2011-08-29 1 bcr162 pnp silicon digital transistor ? switching circuit, inverter, interface circuit, driver circuit ? built in bias resistor (r 1 = 4.7k ? , r 2 = 4.7k ? ) ? pb-free (rohs compliant) package ? qualified according aec q101 bcr162 eha07183 3 2 1 c e b r 1 r 2 type marking pin configuration package bcr162 wus 1=b 2=e 2=c - - - sot23 maximum ratings parameter symbol value unit collector-emitter voltage v ceo 50 v collector-base voltage v cbo 50 input forward voltage v i(fwd) 30 input reverse voltage v i(rev) 10 collector current i c 100 ma total power dissipation- t s 102c p tot 200 mw junction temperature t j 150 c storage temperature t st g -65 ... 150 thermal resistance parameter symbol value unit junction - soldering point 1) r thjs 240 k/w
2011-08-29 2 bcr162 electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 100 a, i b = 0 v (br)ceo 50 - - v collector-base breakdown voltage i c = 10 a, i e = 0 v (br)cbo 50 - - collector-base cutoff current v cb = 40 v, i e = 0 i cbo - - 100 na emitter-base cutoff current v eb = 10 v, i c = 0 i ebo - - 1.61 ma dc current gain 2) i c = 5 ma, v ce = 5 v h fe 20 - - - collector-emitter saturation voltage 2) i c = 10 ma, i b = 0.5 ma v cesat - - 0.3 v input off voltage i c = 100 a, v ce = 5 v v i(off) 0.8 - 1.5 input on voltage i c = 2 ma, v ce = 0.3 v v i(on) 1 - 2.5 input resistor r 1 3.2 4.7 6.2 k ? resistor ratio r 1 / r 2 0.9 1 1.1 - ac characteristics transition frequency i c = 10 ma, v ce = 5 v, f = 100 mhz f t - 200 - mhz collector-base capacitance v cb = 10 v, f = 1 mhz c cb - 3 - pf 1 for calculation of r thja please refer to application note an077 (thermal resistance calculation) 2 pulse test: t < 300s; d < 2%
2011-08-29 3 bcr162 dc current gain h fe = ? ( i c ) v ce = 5 v (common emitter configuration) 10 -4 10 -3 10 -2 10 -1 a i c 0 10 1 10 2 10 3 10 h fe -40 c -25 c 25 c 85 c 125 c collector-emitter saturation voltage v cesat = ? ( i c ), i c /i b = 20 10 -3 10 -2 10 -1 a i c 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 v 0.5 v cesat -40 c -25 c 25 c 85 c 125 c input on voltage v i (on) = ? ( i c ) v ce = 0.3v (common emitter configuration) 10 -5 10 -4 10 -3 10 -2 10 -1 a i c -1 10 0 10 1 10 2 10 v v i(on) -40 c -25 c 25 c 85 c 125 c input off voltage v i(off) = ? ( i c ) v ce = 5v (common emitter configuration) 10 -5 10 -4 10 -3 10 -2 10 -1 a i c -1 10 0 10 1 10 v v i(off) -40 c -25 c 25 c 85 c 125 c
2011-08-29 4 bcr162 total power dissipation p tot = ? ( t s ) bcr162 0 15 30 45 60 75 90 105 120 c 150 t s 0 25 50 75 100 125 150 175 200 225 250 mw 300 p tot permissible pulse load p totmax / p totdc = ? ( t p ) bcr162 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 - p totmax / p totdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible pulse load r thjs = ? ( t p ) bcr162 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs 0.5 0.2 0.1 0.05 0.02 0.01 0.005 d = 0
2011-08-29 5 bcr162 package sot23 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 0.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 0.1 10? max. m 2.4 0.15 0.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2011-08-29 6 bcr162 edition 2009-11-16 published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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